CONDUCTIVE ADHESIVE AGENT AND ELECTRODE JUNCTION STRUCTURE AND SEMICONDUCTOR PACKAGE USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a conductive adhesive agent useful for electrically connecting an electrode of an electronic component and an electrode of a package while maintaining reduction in connection resistance and reduction in thermal stress, without using a substrate dedicated to the electronic component, in manufacturing a semiconductor package.

SOLUTION: A conductive adhesive agent contains at least a binder resin and (1) a conductive metal filler, (2) a reductant, and/or (3) an antioxidant, which are blended into the binder resin.

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