发明名称 MOLDING DIE DEVICE OF RESIN MOLDING
摘要 <P>PROBLEM TO BE SOLVED: To provide a molding die device of the resin molding that can make the other punching block a moving structure without using a hydraulic cylinder. <P>SOLUTION: A punching block 3 of the movable side arranged protruding from the mold surface 1A of a core mold 1 by gas spring 6 is pressed by the punching block 4 of the fixed side provided on a mold surface 2A of a cavity mold 2 in a mold clamping and injection process and moves back. As a result, a pressure welding state of the punching blocks 3 and 4 is maintained by a big spring force of the gas spring 6, and a porous part G that has a lot of perforations in resin molding D-T can be molded. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012236373(A) 申请公布日期 2012.12.06
申请号 JP20110107790 申请日期 2011.05.13
申请人 KASAI KOGYO CO LTD 发明人 OMA HIROFUMI
分类号 B29C45/17;B29C45/26 主分类号 B29C45/17
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