APPARATUS AND METHOD FOR FORMING AN ENCAPSULATION MATERIAL FOR A LIGHT-EMITTING DEVICE
摘要
Disclosed is an apparatus for forming an encapsulation material for a light emitting device. The apparatus for forming an encapsulation material comprises: an upper mold on which is mounted a substrate having a plurality of optical semiconductors; a lower mold arranged opposite the upper mold; a resin-capture space for capturing a resin between the upper mold and the lower mold; and an ejector pin for dividing the resin-capture space into a plurality of spaces at the position where the encapsulating material is formed, thereby dividing the encapsulation material into a plurality of parts formed on the substrate.
申请公布号
WO2012165822(A2)
申请公布日期
2012.12.06
申请号
WO2012KR04186
申请日期
2012.05.25
申请人
SEOUL SEMICONDUCTOR CO., LTD.;SHIN, HYUNG JIN;HONG, GI WON;BAEK, YOUNG DAE