发明名称 |
INJECTION MOLDED SOLDER PROCESS FOR FORMING SOLDER BUMPS ON SUBSTRATES |
摘要 |
Solder bumps of uniform height are provided on a substrate through the use of injection molded solder. Copper pillars or ball limiting metallurgy are formed over I/O pads within the channels of a patterned layer of photoresist. Solder is injected over the pillars or BLM, filling the channels. The solder, which does not contain flux, is allowed to solidify. It forms a plurality of solder structures (bumps) of equal heights. Solder injection and solidification are preferably carried out in a nitrogen environment or a forming gas environment. Molten solder can be injected in channels formed in round wafers without spillage using a carrier assembly that accommodates such wafers and a fill head. |
申请公布号 |
US2012305633(A1) |
申请公布日期 |
2012.12.06 |
申请号 |
US201113154412 |
申请日期 |
2011.06.06 |
申请人 |
FEGER CLAUDIUS;MCLEOD MARK H.;NAH JAE-WOONG;PERFECTO ERIC D.;INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
FEGER CLAUDIUS;MCLEOD MARK H.;NAH JAE-WOONG;PERFECTO ERIC D. |
分类号 |
B23K1/20;B23K31/02 |
主分类号 |
B23K1/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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