BUMP POSITION DERIVATION METHOD, BUMP FORMING POSITION CORRECTION METHOD, BUMP BONDER, AND BUMP APPEARANCE INSPECTION DEVICE

摘要

[Problem] To provide a bump position derivation method, bump forming position correction method, bump bonder, and bump appearance inspection device that can carry out position correction such that a bump is accurately formed in an intended position on a wafer. [Solution] The bump forming position correction method for the bump bonder has: a bump forming step for forming bumps on the wafer using bump bonder capillaries; a chamfer trace part recognition step that recognizes a chamfer trace part wherein the capillary shapes have been transferred to the bumps formed by the bump forming process; a bump forming position derivation step that derives the actual bump forming positions from an image acquired in the chamfer trace recognition step; and a position correcting step that compares the actual bump forming positions with the bump forming positions established in advance and corrects positions in which bumps are to be formed thereafter.