| 摘要 |
<p>Provided is a resin composition comprising a binder resin (A), a radiation-sensitive compound (B), a silane-modified resin (C) and an antioxidant (D), the resin composition characterized in that the content of the silane-modified resin (C) is 0.1 to 150 parts by weight per 100 parts by weight of the binder resin (A); the content of the antioxidant (D) is 0.1 to 10 parts by weight per 100 parts by weight of the binder resin (A); and when a resin film having a thickness of 2 to 3 µm is molded using the resin composition and the molded resin film is baked at 230ºC, the amount of curvature is 14 µm or less.</p> |
