发明名称 MOLD SWITCH AND DEVICE WITH THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To improve a cooling performance. <P>SOLUTION: A mold switch assembly comprises a stationary electrode, a movable electrode that can be approached to or separated from the stationary electrode, a stationary conductor connected to the stationary electrode, and a movable conductor connected to the movable electrode. Power is received from a bus side, and is supplied to a load side. The movable electrode is approached to or separated from the stationary electrode, so that three single-phase mold switches for inputting and blocking a current are assembled. The mold switch of each phase includes a region, in which an outer periphery of the mold switch is coated with a ground metal plate, and a region, in which the outer periphery is coated with a solid insulator. Among at least three phase mold switches, for the mold switch whose both ends are coated with the other phase mold switches, gas can flow around the region, in which the outer periphery is coated with the solid insulator. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012239246(A) 申请公布日期 2012.12.06
申请号 JP20110104834 申请日期 2011.05.10
申请人 HITACHI LTD 发明人 OKANO TAKUYA;MORITA AYUMI;KOBAYASHI MASAHITO;KIKUKAWA SHUICHI
分类号 H02B1/56;H01H33/662;H02B1/20;H02B1/28;H02B13/02 主分类号 H02B1/56
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