| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wafer processing tape that has an excellent dicing property and an excellent expanding property, and can be manufactured inexpensively. <P>SOLUTION: A dicing/die-bonding integral tape 1 that is a wafer processing tape comprises a substrate layer 2 forming a base of a tape, a sticking layer 3 provided on one face 2a of the substrate layer 2, and an adhesion layer 4 provided on the sticking layer 3. The substrate layer 2 is made of a material such that B is 270% or more and B/A is 0.5 or more and 0.9 or less when a fracture elongation rate before radiating ultraviolet ray is A and a fracture elongation rate after radiating the ultraviolet ray is B. The fracture elongation rate on one face 2a side of the substrate layer 2 is lower than the fracture elongation rate on the other face 2b side by radiation of the ultraviolet ray on the face 2a. In this manner, the fracture elongation rate on the face 2a side is made low and the fracture elongation rate on the other face 2b side is made high, so that both of a dicing property and an expanding property can be provided. <P>COPYRIGHT: (C)2013,JPO&INPIT |
