发明名称 COMPOUND FILM FOR INDUSTRIAL PACKAGING APPLICATIONS
摘要 The present invention refers to a compound film (1) comprising at least a heat-sealable inner layer (2), a heat-resistant outer layer (3), and a barrier layer (4) forming a barrier to corrosive gaseous species. It is characterized in that the barrier layer (4) comprises one primary barrier layer (6), one secondary barrier layer (7), said primary barrier layer (6) comprising a polypropylene film (8) on which a layer (9) of a material selected from the group consisting of a metal, a metal oxide, or a silicon oxide is deposited, and said secondary barrier layer (7) comprising a material selected from the group consisting of a metal, a metal-containing material, a metal oxide-containing material or a silicon oxide-containing material.
申请公布号 WO2012164027(A1) 申请公布日期 2012.12.06
申请号 WO2012EP60264 申请日期 2012.05.31
申请人 VALSEM INDUSTRIES SAS;DAVIET, JEAN-FRANCOIS;BORDREZ, DENIS 发明人 DAVIET, JEAN-FRANCOIS;BORDREZ, DENIS
分类号 B32B27/32 主分类号 B32B27/32
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