发明名称 SUBSTRATE PROCESSING SYSTEM, SUBSTRATE DETECTION DEVICE AND SUBSTRATE DETECTION METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a substrate processing system in which the detection time of a substrate can be shortened, and thereby the throughput of processing the substrate can be enhanced, and to provide a substrate detection device and a substrate detection method. <P>SOLUTION: The substrate processing system 1 comprises: a first detection unit 40 which detects a wafer W in the state before processing; and a second detection unit 50 which detects a wafer W in the state after processing. The first detection unit 40 detects whether or not a wafer W in the state before processing has been housed in each housing part 82 of a housing container 80, and detects the housing state of each wafer W in the state before processing housed in each housing part 82. The second detection unit 50 detects collectively whether or not a wafer W in the state after processing has been housed in each housing part 82 of the housing container 80. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012238875(A) 申请公布日期 2012.12.06
申请号 JP20120162795 申请日期 2012.07.23
申请人 TOKYO ELECTRON LTD 发明人 TANAKA YUICHI
分类号 H01L21/67;H01L21/304 主分类号 H01L21/67
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