| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a printed circuit board including a via pad with concavo-convex patterns and a method of manufacturing the same. <P>SOLUTION: The printed circuit board includes: a circuit pattern 12 formed on a first insulating layer 11; a via pad 13 disposed on the first insulating layer 11 with a distance from the circuit pattern 12, formed on a lower surface, where a via hole A is formed, to have a cross section larger than that of the via hole A, and having concavo-convex patterns 13a, 13b; a second insulator 14 formed on the via pad 13 where the via hole A is not formed and on the circuit pattern 12; and a copper foil layer 15 formed on the second insulator 14 and the via hole A. <P>COPYRIGHT: (C)2013,JPO&INPIT |
