发明名称 |
RESIN SUBSTRATE HAVING METAL FILM PATTERN FORMED THEREON |
摘要 |
The purpose of the present invention is to provide a method for using a metal ion solution of low concentration to efficiently form a metal film pattern of excellent accuracy and reliable adhesion on a resin substrate. A resin substrate having a metal film pattern formed thereon is produced by a method that includes the following steps (a) to (e): (a) a step for pattern-printing of a latent image agent (2) onto the surface of a resin substrate (1); (b) a step for bringing the area imprinted with the latent image agent (2) into contact with a solution containing metal ions, and forming a metal salt (3); (c) a step for bringing the metal salt (3) into contact with an acidic treatment liquid containing a reducing agent, and reducing the metal salt; (d) a step for forming an electroless nickel plating film (5) on the area imprinted with the latent image agent; and (e) a step for precipitating an electroless copper plating (6) onto the surface of the nickel plating film (5). |
申请公布号 |
WO2012165168(A1) |
申请公布日期 |
2012.12.06 |
申请号 |
WO2012JP62719 |
申请日期 |
2012.05.17 |
申请人 |
SEIREN CO., LTD.;BAMBA AKIMITSU;TSUJIMOTO KAZUHISA;YAMADA HIDEYUKI;KUGIMIYA KOUICHI |
发明人 |
BAMBA AKIMITSU;TSUJIMOTO KAZUHISA;YAMADA HIDEYUKI;KUGIMIYA KOUICHI |
分类号 |
H05K3/18;B41M1/10;B41M1/30 |
主分类号 |
H05K3/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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