PLATING METHOD

摘要

In the present invention, defects of a metal applied to a through hole are eliminated by changing an angle at which a plating solution is sprayed, or by changing the attitude of a printed board, at a time point in a period when the plating solution is being sprayed toward the printed board, or in a period when the through hole is being filled by precipitating the metal from the plating solution, while spraying air bubbles.