METHOD AND SYSTEM FOR INTERNAL LAYER-LAYER THERMAL ENHANCEMENT
摘要
The exemplary embodiments of the present invention provide a method and apparatus for enhancing the cooling of a chip stack of semiconductor chips. The method includes creating a first chip with circuitry on a first side and creating a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The method further includes creating a cavity in a second side of the first chip between the connectors and filling the cavity with a thermal material. The chip stack of semiconductor chips with enhanced cooling apparatus includes a first chip with circuitry on a first side and a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The apparatus further includes wherein portions of a second side of the first chip between the connectors is removed to provide a cavity in which a thermal material is placed.
申请公布号
US2012306088(A1)
申请公布日期
2012.12.06
申请号
US201113151672
申请日期
2011.06.02
申请人
BARTLEY GERALD K.;JOHNSON CHARLES L.;KELLY, III JOHN E.;MOTSCHMAN DAVID R.;INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人
BARTLEY GERALD K.;JOHNSON CHARLES L.;KELLY, III JOHN E.;MOTSCHMAN DAVID R.