| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide: a thermosetting composition suitable for electronic parts or the like, having excellent low thermal expansion, high glass transition temperature, low dielectric characteristic, copper foil adhesiveness, solder heat resistance, copper-clad heat resistance, flame retardancy and drillability, especially excellent in low water absorption and desmearing resistance, and further excellent in low toxicity, safety and working environment; a prepreg; and a laminated board. <P>SOLUTION: This thermosetting resin composition includes a bismaleimide derivative (A) having polyazomethine represented by general formula (I) and an epoxy resin (B) having at least two epoxy groups in one molecule. The prepreg and the laminated board are obtained by using the composition. <P>COPYRIGHT: (C)2013,JPO&INPIT |
