PRINTED WIRING BOARD, MANUFACTURING METHOD THEREOF, AND PHOTOSENSITIVE RESIN COMPOSITION

摘要

PROBLEM TO BE SOLVED: To provide a method capable of efficiently manufacturing a low-cost printed wiring board having a level difference in an insulation layer which forms an outermost layer.

SOLUTION: A manufacturing method of a printed wiring board for manufacturing a printed wiring board having a level difference in an insulation layer which forms an outermost layer comprises the steps of: forming an insulation layer composed of a photosensitive resin composition on a printed wiring board having a conductor circuit on its surface and then forming an insulation layer pattern by performing first exposure processing and development processing for the insulation layer; performing second exposure processing for the insulation layer pattern and then further performing first thermosetting treatment; and providing a level difference in the insulation layer pattern by performing desmear processing for the insulation layer pattern after the first thermosetting treatment.

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