发明名称 |
DEFECT INSPECTION METHOD, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND DEFECT INSPECTION APPARATUS |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a defect inspection method capable of improving accuracy of defect detection. <P>SOLUTION: After first defect inspection processing (step S11) for inspecting whether there is a defect on a wafer or not is performed, a defective chip is determined by the defect detected by the first defect inspection processing (steps S12, S13). Next, whether chips adjacent to the defective chip have defects or not is inspected excluding the defective chip with inspection sensitivity higher than that of the first defect inspection processing (step S16). <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2012238801(A) |
申请公布日期 |
2012.12.06 |
申请号 |
JP20110108376 |
申请日期 |
2011.05.13 |
申请人 |
FUJITSU SEMICONDUCTOR LTD |
发明人 |
TAKAHASHI NAOHIRO;YASUMOTO TAMIHIDE;AKABOSHI FUMIHIKO |
分类号 |
H01L21/66 |
主分类号 |
H01L21/66 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|