| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate processing apparatus that performs plasma processing with surrounding a circumference of a substrate by a rectification member, in which a substrate is not likely to be contaminated by particles and the like at the time of carrying-in/out of the substrate. <P>SOLUTION: In a substrate processing apparatus 1, a substrate G is loaded on a loading table 3 of a chamber 2, and plasma of a process gas is formed to perform plasma processing on the substrate G with surrounding the substrate G by a rectification member 9. The rectification member 9 is composed of four side plates 9a, 9b that form a square tube. At least the side plate 9a as a movable member arranged at a position corresponding to a substrate carrying-in/out port 31 is provided movable to a retreat position so as to allow the substrate G to be carried-in/out with respect to the loading table 3. The side plate 9a is formed to rotate between a processing position at the time of processing and the retreat position by rotation of a rotation axis 47. The rotation axis 47 and the side plate 9a are coupled by a coupling member 45 and the side plate 9a is rotated by rotation of the coupling member 45. <P>COPYRIGHT: (C)2013,JPO&INPIT |
