发明名称 COPPER ALLOY SHEET FOR ELECTRIC AND ELECTRONIC PART
摘要 A shear plane ratio is reduced by a dislocation density in which a value obtained by dividing the half-value width &bgr; of the intensity of diffraction of {311} plane in the surface of a Cu—Fe—P alloy sheet, by its peak height H, is 0.015 or more. In addition, a Cu—Fe—P alloy sheet with relatively small Fe content is provided with a texture in which a ratio (I(200)/I(220)) of intensity of diffraction of (I(200)) from the (200) plane in the sheet surface to intensity of diffraction of (I(220)) from the (220) plane, is 0.3 or less. In addition, a Cu—Fe—P alloy sheet with relatively small Fe content is provided with a texture in which the orientation distribution density of Brass orientation measured by the crystal orientation analysis method using an EBSP by an FE-SEM, is 25% or more; and an average grain size in the sheet is 6.0 μm or less.
申请公布号 US2012308429(A1) 申请公布日期 2012.12.06
申请号 US201213585076 申请日期 2012.08.14
申请人 ARUGA YASUHIRO;OZAKI RYOICHI;MIWA YOSUKE;KABUSHIKI KAISHA KOBE SEIKO SHO (KOBE STEEL, LTD.) 发明人 ARUGA YASUHIRO;OZAKI RYOICHI;MIWA YOSUKE
分类号 C22C9/02 主分类号 C22C9/02
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