METHOD OF ATTACHING A LIGHT EMITTING DEVICE TO A SUPPORT SUBSTRATE

摘要

A method according to embodiments of the invention includes bonding a semiconductor light emitting device (33) to a surface of a support substrate (34), the semiconductor light emitting device including a light emitting layer (14) sandwiched between an n-type region (12) and a p-type region (16). The support substrate (34) includes a body (35). After bonding, a first via (48) is etched through an entire thickness of the body (35) region to expose a metal (26) electrically connected to the n-type region (12). A second via (48) is etched through an entire thickness of the body (35) to expose a metal (32) electrically connected to the p-type region (16).