| 摘要 |
<p>Disclosed is a passive electronic tag, including: a radiation surface and a second substrate thereunder; a ground surface under the second substrate; a first substrate between the radiation surface and the second substrate; an opening passing through the radiation surface and the first substrate; a tag chip located between the upper surface of the second substrate and the lower surface of the first substrate and in the opening; a first and a second through-hole unit respectively located on either side of the radiation surface, the first substrate, the second substrate and the ground surface and consisting of a plurality of second through-holes, the second through-holes being electrically connected to the radiation surface and the ground surface through the first and second substrate; a first and second binding through-hole passing through the tag chip, the first substrate and the radiation surface instead of the ground surface; and a first and second feeder arranged on either side of the tag chip for binding same and connecting the radiation surface via the first and second binding through-holes. The present invention improves the ability of the tag to protect the chip data and corrects the frequency offset generated by production errors.</p> |
