PLASMA TREATMENT DEVICE, CONVEYANCE CARRIER, AND PLASMA TREATMENT METHOD

摘要

A plasma treatment for treating a substrate held on a holding sheet, in which radiation of heat to the substrate from a cover covering the holding sheet is effectively minimized. The conveyance carrier (5) has a holding sheet (6) for holding a wafer (2), and a frame (7). A protrusion (34) is provided to the lower surface (32b) of the body (32) of the cover (31) covering the holding sheet (6) and the frame (7). The protrusion (34) passes through an opening (8) provided to the holding sheet (6), and a tip (34a) comes into contact with the upper end surface (21) of an electrode section (21). A stage section (16) including the electrode section (21) is cooled in a cooling device (24).