| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wafer chamfering part removal device capable of removing a chamfering part in a two-layer structure wafer in which a surface of the wafer is stuck to a substrate without damaging the substrate. <P>SOLUTION: An wafer chamfering removal device comprises: a chuck table 34; a grinding unit; Z-axis direction feeding means for feeding the grinding unit in a Z-axis direction; Y-axis direction feeding means for relatively feeding the grinding unit in a Y-axis direction; Y-axis direction position detection means; Z-axis direction position detection means; imaging means for imaging a grinding region of a workpiece held in the chuck table 34; boundary height position direction means for detecting a height position of a boundary between a wafer 11 in a two-layer structure wafer 10 held in the chuck table 34 and a substrate 12; and control means. The control means controls the Z-axis direction feeding means on the basis of information for the height position of the boundary between the chamfering part to be removed of the wafer 11 and the substrate 12 detected by the boundary height position detection means. <P>COPYRIGHT: (C)2013,JPO&INPIT |
