| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device, which has resistive elements, that allows low power consumption and high circuit accuracy without reducing integration density. <P>SOLUTION: A semiconductor device includes a plurality of resistive elements made from a semiconductor material, a resistive element for heating disposed adjacent to the plurality of resistive elements, and a resistor bridge circuit in which the resistive element for heating is connected between two facing connection nodes and a power line is connected between the other two facing connection nodes. <P>COPYRIGHT: (C)2013,JPO&INPIT |
