| 摘要 |
<P>PROBLEM TO BE SOLVED: To perform precise development processing individually for each shot in the substrate surface. <P>SOLUTION: The development processor has a substrate holding part for holding a wafer W, a nozzle set formed by arranging a plurality of supply nozzles 90, each provided with a liquid developer ejection port for ejecting a liquid developer and is shorter than the diameter of the wafer, from one end side of the wafer W toward the other end side thereof with no clearance over a length equal to or longer than the diameter of the wafer, and a shaft 84 which translates each supply nozzle 90 horizontally in the direction perpendicular to the length direction of the nozzle set. The moving speed of the supply nozzle 90 on the shaft is variable. <P>COPYRIGHT: (C)2013,JPO&INPIT |
