发明名称 |
SEMICONDUCTOR DEVICE MANUFACTURING APPARATUS |
摘要 |
A semiconductor device manufacturing apparatus includes: a first pattern forming unit for forming a first pattern by patterning a first mask material layer; a trimming unit for reducing a width of the first pattern to a predetermined width; a boundary layer forming unit for forming a boundary layer, on a surface of the first pattern; a second mask material layer forming unit for forming a second mask material layer on a surface of the boundary layer; a second mask material removing unit for removing a part of the second mask material layer to expose top portions of the boundary layer; and a boundary layer etching unit for exposing the first pattern and forming a second pattern having the second mask material layer at a top portion thereof by etching the boundary layer. |
申请公布号 |
US2012305183(A1) |
申请公布日期 |
2012.12.06 |
申请号 |
US201213590298 |
申请日期 |
2012.08.21 |
申请人 |
YAEGASHI HIDETAMI;SHIMURA SATORU;HAYAKAWA TAKASHI;TOKYO ELECTRON LIMITED |
发明人 |
YAEGASHI HIDETAMI;SHIMURA SATORU;HAYAKAWA TAKASHI |
分类号 |
H01L21/308;G03F7/40;H01L21/027;H01L21/3065 |
主分类号 |
H01L21/308 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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