DEVICE FOR TREATING SURFACES OF WAFER-SHAPED ARTICLES
摘要
<p>A device for liquid treatment of a wafer-shaped article comprises a closed process chamber, and a ring chuck located within the closed process chamber. The ring chuck is adapted to be driven without physical contact through a magnetic bearing. A magnetic stator surrounds the closed process chamber. The closed process chamber has a cylindrical wall positioned between the ring chuck and the magnetic stator during liquid treatment of a wafer-shaped article. Various structures are provided to prevent upward ingress of processing liquid into a gap defined between the ring chuck and the cylindrical wall.</p>
申请公布号
WO2012164455(A1)
申请公布日期
2012.12.06
申请号
WO2012IB52608
申请日期
2012.05.24
申请人
LAM RESEARCH AG;LAM RESEARCH CORPORATION;LACH, OTTO;TSCHINDERLE, ULRICH;JUNK, MARKUS