发明名称 |
Transfer device for transferring e.g. semiconductor chip on printed circuit board, has suction element resting at guide surface at region of guide element, where guide surface and cone-shaped guide surface form point- or circular contact |
摘要 |
<p>The device (10) has a suction element (11) with suction openings on a side turned toward an electrical or electronic part. The suction element is in abutting contact to an up and down movable housing (20) in a position and tiltably arranged in planes vertical to a longitudinal axis (13) of the housing in another position. The suction element rests at a funnel-shaped guide surface at an end region of a guide element on another side turned away from the electrical or electronic part. The funnel-shaped guide surface and a cone-shaped guide surface form a point- or circular contact. The guide element is formed as a pin-like element. The housing is formed in a form of a prism bearing.</p> |
申请公布号 |
DE102011076857(A1) |
申请公布日期 |
2012.12.06 |
申请号 |
DE20111076857 |
申请日期 |
2011.06.01 |
申请人 |
ROBERT BOSCH GMBH |
发明人 |
HOLDER, SIEGFRIED;SAALFRANK, JOERG;SCHMID, STEFFEN |
分类号 |
H05K13/04;B65G47/91 |
主分类号 |
H05K13/04 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|