发明名称 Transfer device for transferring e.g. semiconductor chip on printed circuit board, has suction element resting at guide surface at region of guide element, where guide surface and cone-shaped guide surface form point- or circular contact
摘要 <p>The device (10) has a suction element (11) with suction openings on a side turned toward an electrical or electronic part. The suction element is in abutting contact to an up and down movable housing (20) in a position and tiltably arranged in planes vertical to a longitudinal axis (13) of the housing in another position. The suction element rests at a funnel-shaped guide surface at an end region of a guide element on another side turned away from the electrical or electronic part. The funnel-shaped guide surface and a cone-shaped guide surface form a point- or circular contact. The guide element is formed as a pin-like element. The housing is formed in a form of a prism bearing.</p>
申请公布号 DE102011076857(A1) 申请公布日期 2012.12.06
申请号 DE20111076857 申请日期 2011.06.01
申请人 ROBERT BOSCH GMBH 发明人 HOLDER, SIEGFRIED;SAALFRANK, JOERG;SCHMID, STEFFEN
分类号 H05K13/04;B65G47/91 主分类号 H05K13/04
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