发明名称 TRANSLUCENT WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a translucent wiring board including a translucent alumina substrate and a wiring pattern formed on a surface of the translucent alumina substrate, in which adhesion between the wiring pattern and the translucent alumina substrate is maintained after the application of heat cycles, and translucency of the wiring board can be obtained. <P>SOLUTION: A translucent wiring board 8 includes a translucent alumina substrate 1 and a wiring pattern 2 formed on a surface 1a of the translucent alumina substrate 1. A smooth surface 5 and a rough surface 6 are formed on the surface 1a of the translucent alumina substrate 1, and the wiring pattern 2 is formed on the rough surface 6 but not formed on the smooth surface 5. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012238654(A) 申请公布日期 2012.12.06
申请号 JP20110105377 申请日期 2011.05.10
申请人 NGK INSULATORS LTD 发明人 MIYAZAWA SUGIO;WATANABE KEIICHIRO;OHASHI HARUAKI
分类号 H01L23/12;H01L23/15 主分类号 H01L23/12
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