| 摘要 |
[Problem] To provide a resin composition for a printed wiring board, a prepreg, a laminate, and a metal foil clad laminate, the resin composition retaining a high level of flame retardance without using a halogenated compound or a phosphorus compound, and having a low coefficient of water absorption, a high glass transition temperature, and a high modulus of elasticity at high temperatures. [Solution] This resin composition comprises a specific maleimide compound (A), a cyanic acid ester compound (B), a non-halogen epoxy resin (C) and an inorganic filler (D). |
