| 发明名称 |
PLASMA SPUTTERING PROCESS FOR PRODUCING PARTICLES |
| 摘要 |
A high production rate plasma sputtering process for producing particles having a size of 10 μm or less is disclosed. The process causes ionization of at least a part of the sputtered target atoms and is performed at such parameters that the pick-up probability of ionized sputtered target atoms on the surface of grains is high. |
| 申请公布号 |
US2012305385(A1) |
申请公布日期 |
2012.12.06 |
| 申请号 |
US201113579862 |
申请日期 |
2011.02.22 |
| 申请人 |
HELMERSSON ULF;BRENNING NILS;SODERSTROM DANIEL;TIAA AB |
发明人 |
HELMERSSON ULF;BRENNING NILS;SODERSTROM DANIEL |
| 分类号 |
C23C14/35;C23C14/46 |
主分类号 |
C23C14/35 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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