发明名称 APPARATUSES INCLUDING STAIR-STEP STRUCTURES AND METHODS OF FORMING THE SAME
摘要 Methods for forming semiconductor structures are disclosed, including a method that involves forming sets of conductive material and insulating material, forming a first mask over the sets, forming a first number of contact regions, forming a second mask over a first region of the sets, and removing material from of the sets in a second, exposed region laterally adjacent the first region to form a second number of contact regions. Another method includes forming first and second contact regions on portions of sets of conductive materials and insulating materials, each of the second contact regions more proximal to an underlying substrate than each of the first contact regions. Apparatuses such as memory devices including laterally adjacent first and second regions each including contact regions of a different portion of a plurality of conductive materials and related methods of forming such devices are also disclosed.
申请公布号 WO2012166483(A2) 申请公布日期 2012.12.06
申请号 WO2012US39215 申请日期 2012.05.23
申请人 MICRON TECHNOLOGY, INC.;FREEMAN, ERIC H.;SMITH, MICHAEL A. 发明人 FREEMAN, ERIC H.;SMITH, MICHAEL A.
分类号 H01L21/8247;H01L27/115 主分类号 H01L21/8247
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