发明名称 VIALESS MEMORY STRUCTURE AND METHOD OF MANUFACTURING SAME
摘要 A method of manufacturing a magnetic memory cell, including a magnetic tunnel junction (MTJ), includes using silicon nitride layer and silicon oxide layer to form a trench for depositing copper to be employed for connecting the MTJ to other circuitry without the use of a via.
申请公布号 US2012306033(A1) 申请公布日期 2012.12.06
申请号 US201113154346 申请日期 2011.06.06
申请人 SATOH KIMIHIRO;HUAI YIMING;ZHANG JING;AVALANCHE TECHNOLOGY, INC. 发明人 SATOH KIMIHIRO;HUAI YIMING;ZHANG JING
分类号 H01L43/02;H01L43/12 主分类号 H01L43/02
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