发明名称 ELECTRICALLY CONDUCTIVE SHEET AND PROCESS FOR PRODUCING SAME, AND ELECTRONIC COMPONENT
摘要 <p>Provided are: an electrically conductive sheet having good processability, whereby it becomes possible to minimize the leaching of an electrically conductive layer in a hot-pressing step for adhering the electrically conductive sheet onto an object of interest, such as a printed wiring board; a process for producing the electrically conductive sheet; and others. This electrically conductive sheet involves an electrically conductive layer comprising at least a heat-curable resin (A) and dendritic electrically conductive microparticles (B). The thickness of the electrically conductive layer fulfills the following requirement (i) and/or (ii): (i) the thickness of the electrically conductive layer becomes 30-95 after being hot-pressed under the conditions of 150ºC, 2 MPa and 30 minutes when the thickness of the electrically conductive layer before the hot-pressing is defined as 100; and (ii) the average particle diameter (D90) of the dendritic electrically conductive microparticles (B) becomes 0.5-3 times the thickness of the electrically conductive layer. The dendritic electrically conductive microparticles (B) have an average particle diameter (D50) of 3-50 µm inclusive and are contained in an amount of 50-90 wt% inclusive in the electrically conductive layer.</p>
申请公布号 WO2012164925(A1) 申请公布日期 2012.12.06
申请号 WO2012JP03541 申请日期 2012.05.30
申请人 TOYO INK SC HOLDINGS CO., LTD.;NISHIYAMA, YUJI;TOMINAGA, HIROSHI;FURUKAWA, KUNIHIRO;KOBAYASHI, HIDENOBU;MATSUDO, KAZUNORI;MATSUZAWA, TAKAHIRO;JUN, SEI 发明人 NISHIYAMA, YUJI;TOMINAGA, HIROSHI;FURUKAWA, KUNIHIRO;KOBAYASHI, HIDENOBU;MATSUDO, KAZUNORI;MATSUZAWA, TAKAHIRO;JUN, SEI
分类号 H01B5/16;B32B27/18;C09J7/00;C09J9/02;C09J11/04;C09J201/10;H05K9/00 主分类号 H01B5/16
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