发明名称 ELECTRONIC COMPONENT MOUNTING APPARATUS
摘要 PURPOSE: An electronic component mounting apparatus is provided to supplement electronic components in a component supply device without stopping production by replacing an electronic component receiving tape in a splicing method to supplement the electronic components. CONSTITUTION: A head(15) includes a head main body(30), a camera unit(36)and a laser recognition device(38). The head main body includes a head support(31), a plurality of nozzles(32), and a nozzle driver(34). A feeder(28) includes a drawing device(46) of an electronic component receiving tape(100) hold in a holding part. The head support supports the nozzle and the nozzle driver. The nozzle driver drives the nozzle. [Reference numerals] (210) Head controller; (212) Controller; (220) Photographing controller; (222) Component supply controller; (AA) Z-axis direction; (BB) Y-axis direction
申请公布号 KR20120132429(A) 申请公布日期 2012.12.05
申请号 KR20120056247 申请日期 2012.05.25
申请人 发明人
分类号 H05K13/02;H05K13/04 主分类号 H05K13/02
代理机构 代理人
主权项
地址