| 摘要 |
PURPOSE: A semiconductor device and a manufacturing method thereof are provided to shield EMI(Electro Magnetic Interference) in a package level. CONSTITUTION: A substrate(100) includes a first metal layer(110), a first wire(120), a second wire(130,131), and an insulation layer(102). The first metal layer includes an exposure side(110a) which is exposed to the side of the substrate. A semiconductor chip(180) is formed on one side of the substrate. A molding member(198) molds the semiconductor chip. An external connection terminal(170,171) is formed on the other side of the substrate. |
