发明名称
摘要 <P>PROBLEM TO BE SOLVED: To provide a polishing liquid capable of sufficiently increasing polishing speed while keeping etching speed low, suppressing the generation of corrosion of metal surface and dishing (sinking in dish shape), and forming highly reliable embedded patterns of metal films. Ž<P>SOLUTION: The polishing liquid for metal contains an oxidant, an oxidized metal dissolving agent, a first metal anticorrosive, a second metal anticorrosive and water; wherein the first metal anticorrosive is a compound having amino-triazol skeleton in which amino group is bonded to carbon of triazol ring, and the second metal anticorrosive is at least one selected from the group consisting of compounds having imidazol skeleton expressed by general formula (I) and compounds having triazol skeleton having no amino group. In the general formula (I), R<SB>1</SB>, R<SB>2</SB>and R<SB>3</SB>represent each independently a hydrogen atom, an amino group, or a 1-12C alkyl chain, excluding the case where all of the R<SB>1</SB>, R<SB>2</SB>and R<SB>3</SB>are hydrogen atoms. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP5088352(B2) 申请公布日期 2012.12.05
申请号 JP20090193052 申请日期 2009.08.24
申请人 发明人
分类号 C09K13/00;B24B37/00;C09K3/14;H01L21/304 主分类号 C09K13/00
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