| 摘要 |
PROBLEM TO BE SOLVED: To realize a thinner circuit device while suppressing the cost thereof. SOLUTION: This circuit device 10 has a structure wherein a circuit element 30 is fitted into a recess 28 formed in a wiring board 20. A board electrode 40 provided in the periphery of the recess 28 and an element electrode 50 provided on the circuit element 30 are electrically connected together by a wiring portion 60 integrally formed with projections 62a and 62b. COPYRIGHT: (C)2009,JPO&INPIT |
