| 摘要 |
PURPOSE: A semiconductor encapsulant composition is provided to have high crack-resistance, and to have high thermal conductivity and flame retardance. CONSTITUTION: A semiconductor encapsulant composition comprises 0-13 wt% of an epoxy resin, 6-7 wt% of a curing agent, 0.2-0.3 wt% of a hardening catalyst, 0.60-0.68 wt% of at least one additive selected from a group consisting of a coupling agent, a releasing agent, and a coloring agent, and 79-84 wt% of filler. The filler is a nanographene plate powder. The particle diameter and the thermal conductivity of the nanographene plate powder are 5-40 micron and 400 W/mK respectively. The thermal conductivity of the semiconductor encapsulant composition is 2.0-5.5 W/mk. |
