| 摘要 |
PURPOSE: A substrate warpage removing apparatus and method, a substrate processing apparatus and method, and a storage medium are provided to remove the warpage of a substrate with high accuracy by supplying an etching solution to the rear side of a wafer and removing a thin film formed on the rear side of the wafer. CONSTITUTION: A holding plate(30) holds a wafer(W). A lift pin plate(20) comprises a lift pin(22) which supports the wafer at the lower side. A rotation driving unit(39) rotates the holding plate. A processing liquid supply tube(40) supplies a processing liquid to the rear side of the wafer which is held by the holding plate. An elevating driving unit(50) lifts the processing liquid supply tube. A penetration hole(30a) is formed on the center of the holding plate and a penetration hole(20a) is formed on the center of the lift pin plate. [Reference numerals] (AA) From 4,5 |
