Method of transferring elements, element disposition substrate, device and method of manufacturing the same

摘要

Disclosed herein is a method of transferring elements, including the steps of: holding a plurality of elements made at a first pitch on an element formation substrate on a temporary holding substrate in a state; forming a plurality of element mounting bases and obtaining an element disposition substrate; disposing an uncured adhesive agent layer on each of the bearing surfaces of the element mounting bases; making the temporary holding substrate and the element disposition substrate close to each other and causing some of the plurality of elements to come in contact with the uncured adhesive agent layer; curing the uncured adhesive agent layer, fixing the elements contacting the adhesive agent layer to the element mounting bases; and separating the temporary holding substrate and the element disposition substrate from each other with the elements contacting the adhesive agent layer being left on the respective element mounting bases.