发明名称 |
Method and apparatus for manufacturing LED devices using laser scribing |
摘要 |
A method of manufacturing a light-emitting device using laser scribing to improve overall light output is disclosed. Upon placing a semiconductor wafer having light emitting diode (LED) devices separated by streets on a wafer chuck, the process arranges a first surface of semiconductor wafer containing front sides of the LED devices facing up and a second surface of semiconductor wafer containing back sides of the LED devices facing toward the wafer chuck. After aligning a laser device over the first surface of the semiconductor wafer above a street, the process is configured to focus a high intensity portion of a laser beam generated by the laser device at a location in a substrate closer to the back sides of the LED devices. |
申请公布号 |
US8324636(B2) |
申请公布日期 |
2012.12.04 |
申请号 |
US20100906349 |
申请日期 |
2010.10.18 |
申请人 |
HAMAGUCHI NORIHITO;HASNAIN GHULAM;BRIDGELUX, INC. |
发明人 |
HAMAGUCHI NORIHITO;HASNAIN GHULAM |
分类号 |
H01L33/00 |
主分类号 |
H01L33/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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