发明名称 Nonvolatile memory and fabrication method thereof
摘要 Non-volatile memories formed on a substrate and fabrication methods are disclosed. A bottom electrode comprising a metal layer is disposed on the substrate. A buffer layer comprising a LaNiO3 film is disposed over the metal layer. A resistor layer comprising a SrZrO3 film is disposed on the buffer layer. A top electrode is disposed on the resistor layer.
申请公布号 US8324068(B2) 申请公布日期 2012.12.04
申请号 US20100943487 申请日期 2010.11.10
申请人 TSENG TSEUNG-YUEN;LIN CHUN-CHIEH;LIN CHAO-CHENG;WINBOND ELECTRONICS CORP. 发明人 TSENG TSEUNG-YUEN;LIN CHUN-CHIEH;LIN CHAO-CHENG
分类号 H01L21/20 主分类号 H01L21/20
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