发明名称 Adhesive composition and bonding method
摘要 A two-part type adhesive composition which comprises a first composition comprising (A) a nitrile butadiene rubber having an acrylonitrile content of from 10 to 30%, (B) a polymerizable (meth)acrylic liquid composition, (C) an organic peroxide and (D) a basic compound having an amine structure, and a second composition comprising (E) a reaction condensate of an amine and an aldehyde and (F) a reducing agent containing copper, is provided. In a preferred embodiment, the first composition also contains a photopolymerization initiator. A bonding method using the adhesive composition provides high adhesion and quick curing properties on the second time scale, and a high retention in durability on a high temperature and high humidity test.
申请公布号 US8323448(B2) 申请公布日期 2012.12.04
申请号 US20080679058 申请日期 2008.09.05
申请人 HISHA YUKI;YODA KIMIHIKO;DENKI KAGAKU KOGYO KABUSHIKI KAISHA 发明人 HISHA YUKI;YODA KIMIHIKO
分类号 C04B37/00;B32B7/12;C08J3/28;C08K5/16;C09J4/00;C09J101/00;C09J201/00 主分类号 C04B37/00
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