发明名称 |
Method for providing an energy assisted magnetic recording head in a wafer packaging configuration |
摘要 |
A method for providing energy assisted magnetic recording (EAMR) heads is described. The method comprises bonding a plurality of lasers to a first substrate. The plurality of lasers corresponds to the plurality of EAMR heads and is for providing energy to a plurality of EAMR transducers. The method further comprises fabricating the plurality of EAMR transducers for the plurality of EAMR heads on a second substrate, bonding the first substrate to the second substrate such that the plurality of EAMR transducers and the plurality of lasers reside between the first substrate and the second substrate, removing at least one of the first substrate and the second substrate, and separating a remaining substrate into the plurality of EAMR heads. |
申请公布号 |
US8322022(B1) |
申请公布日期 |
2012.12.04 |
申请号 |
US20100825098 |
申请日期 |
2010.06.28 |
申请人 |
YI GE;YUAN HONGXING;SUN MING;WAN DUJIANG;WESTERN DIGITAL (FREMONT), LLC |
发明人 |
YI GE;YUAN HONGXING;SUN MING;WAN DUJIANG |
分类号 |
G11B5/127;H04R31/00 |
主分类号 |
G11B5/127 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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