发明名称 Semiconductor chip, semiconductor mounting module, mobile communication device, and process for producing semiconductor chip
摘要 A semiconductor chip comprising a capacitor capable of effectively controlling the voltage drop of an LSI is provided. A semiconductor substrate is provided with an element electrode having at least its surface constituted of an aluminum electrode. The surface of the aluminum electrode is roughened. An oxide film is provided on the aluminum electrode. A conductive film is provided on the oxide film. The aluminum electrode, oxide film and conductive film form a capacitor.
申请公布号 US8324623(B2) 申请公布日期 2012.12.04
申请号 US201113080152 申请日期 2011.04.05
申请人 HIRANO KOICHI;OGURA TETSUYOSHI;NAKATANI SEIICHI;PANASONIC CORPORATION 发明人 HIRANO KOICHI;OGURA TETSUYOSHI;NAKATANI SEIICHI
分类号 H01L21/00 主分类号 H01L21/00
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