发明名称 Method for forming silicon film, method for forming pn junction and pn junction formed using the same
摘要 A method for forming a silicon film may be performed using a microheater including a substrate and a metal pattern spaced apart from the substrate. The silicon film may be formed on the metal pattern by applying a voltage to the metal pattern of the microheater to heat the metal pattern and by exposing the microheater to a source gas containing silicon. The silicon film may be made of polycrystalline silicon. A method for forming a pn junction may be performed using a microheater including a substrate, a conductive layer on the substrate, and a metal pattern spaced apart from the substrate. The pn junction may be formed between the metal pattern and the conductive layer by applying a voltage to the metal pattern of the microheater to heat the metal pattern. The pn junction may be made of polycrystalline silicon.
申请公布号 US8324071(B2) 申请公布日期 2012.12.04
申请号 US20090458665 申请日期 2009.07.20
申请人 CHOI JUNHEE;ZOULKARNEEV ANDREI;SAMSUNG ELECTRONICS CO., LTD. 发明人 CHOI JUNHEE;ZOULKARNEEV ANDREI
分类号 H01L21/76;H01L21/20;H01L21/36;H01L21/44 主分类号 H01L21/76
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