发明名称 Silicon carbide semiconductor device and method for manufacturing the same
摘要 A SiC semiconductor substrate is disclosed which includes a SiC single crystal substrate, a nitrogen (N)-doped n-type SiC epitaxial layer in which nitrogen (N) is doped and a phosphorus (P)-doped n-type SiC epitaxial layer in which phosphorus (P) is doped. The nitrogen (N)-doped n-type SiC epitaxial layer and the phosphorus (P)-doped n-type SiC epitaxial layer are laminated on the silicon carbide single crystal substrate sequentially. The nitrogen (N)-doped n-type SiC epitaxial layer and the phosphorus (P)-doped n-type SiC epitaxial layer are formed by using two or more different dopants, for example, nitrogen and phosphorus, at the time of epitaxial growth. Basal plane dislocations in a SiC device can be reduced.
申请公布号 US8324631(B2) 申请公布日期 2012.12.04
申请号 US20070865851 申请日期 2007.10.02
申请人 YONEZAWA YOSHIYUKI;TAWARA TAKESHI;FUJI ELECTRIC CO., LTD. 发明人 YONEZAWA YOSHIYUKI;TAWARA TAKESHI
分类号 H01L29/15;H01L21/18 主分类号 H01L29/15
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