发明名称 |
Integrated circuit device |
摘要 |
An integrated circuit device having at least a bond pad for semiconductor devices and method for fabricating the same are provided. A bond pad has a first passivation layer having a plurality of openings. A conductive layer which overlies the openings and portions of the first passivation layer, having a first portion overlying the first passivation layer and a second portion overlying the openings. A second passivation layer overlies the first passivation layer and covers edges of the conductive layer.
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申请公布号 |
US8324731(B2) |
申请公布日期 |
2012.12.04 |
申请号 |
US20090591532 |
申请日期 |
2009.11.23 |
申请人 |
YU CHEN-HUA;JENG SHWANG-MING;LU YUNG-CHENG;CHANG HUILIN;SHEN TING-YU;LIAO YICHI;TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
YU CHEN-HUA;JENG SHWANG-MING;LU YUNG-CHENG;CHANG HUILIN;SHEN TING-YU;LIAO YICHI |
分类号 |
H01L21/31 |
主分类号 |
H01L21/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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