发明名称 ADHESIVE PREPARATION PACKAGE
摘要 The present invention provides an adhesive preparation package containing an adhesive preparation and a packaging film(s) enclosing said preparation, the packaging films being heat-sealed around the adhesive preparation, wherein the heat-sealed portion of the packaging film comprises an embossed heat-sealed portion and a flat heat-sealed portion, and the embossed heat-sealed portion and the flat heat-sealed portion each form a pattern surrounding the periphery of the adhesive preparation. The adhesive preparation package of the present invention is free of occurrence of pinholes in a heat-sealed portion and can maintain superior air-tightness and sterility.
申请公布号 CA2511166(C) 申请公布日期 2012.12.04
申请号 CA20052511166 申请日期 2005.06.29
申请人 NITTO DENKO CORPORATION 发明人 NINOMIYA, KAZUHISA;GOSHIMA, SHOJI
分类号 B65D75/30;A61L15/44;A61L15/58;B65B11/50;B65D75/20 主分类号 B65D75/30
代理机构 代理人
主权项
地址